MOQ: | 1 peça |
preço: | 0.99-99USD/PCS |
embalagem padrão: | Embalagem |
Período de entrega: | 2-10 dias úteis |
método de pagamento: | T/T, PayPal |
Capacidade de abastecimento: | 50000 peças |
RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin and no solder mask
Hi, I’m excited to introduce one of our premium products: the 4-layer PCB with Rogers RO3010 material. This PCB is designed for high-frequency applications, offering exceptional mechanical and electrical stability, making it ideal for circuit miniaturization and broadband components. With its 2.7mm thickness, immersion tin finish, and blind vias, this PCB is an excellent choice for industries like automotive radar, telecommunications, and satellite communication.
1. Overview of the 4-Layer PCB
Our 4-layer PCB is built with Rogers RO3010 material, a ceramic-filled PTFE composite that provides a high dielectric constant (Dk) of 10.2 ± 0.30 at 10 GHz. This material ensures low loss, dimensional stability, and thermal reliability, making it perfect for compact and high-performance designs.
The PCB has a finished thickness of 2.7mm, with 1oz copper weight on all layers for consistent signal transmission. The blind vias (L1-L2) allow for efficient layer interconnectivity while maintaining the integrity of the signal paths. The immersion tin surface finish ensures excellent solderability and long-term reliability.
2. PCB Construction Details
Parameter | Specification |
Base Material | Rogers RO3010 |
Layer Count | 4 layers |
Board Dimensions | 35mm x 42mm |
Minimum Trace/Space | 6/9 mils |
Minimum Hole Size | 0.4mm |
Via Type | Blind vias (L1-L2) |
Finished Board Thickness | 2.7mm |
Finished Copper Weight | 1oz (1.4 mils) outer layers |
Via Plating Thickness | 20 μm |
Surface Finish | Immersion Tin |
Top Solder Mask | None |
Bottom Solder Mask | None |
Top Silkscreen | None |
Bottom Silkscreen | None |
Electrical Testing | 100% tested to IPC-Class-2 standards |
3. PCB Stackup
Layer | Material | Thickness |
Copper Layer 1 | Copper (1oz) | 35 μm |
Core Material | Rogers RO3010 Substrate | 1.27mm |
Copper Layer 2 | Copper (1oz) | 35 μm |
Bonding Layer | Prepreg 1060 x 1 | 0.05mm |
Copper Layer 3 | Copper (1oz) | 35 μm |
Core Material | Rogers RO3010 Substrate | 1.27mm |
Copper Layer 4 | Copper (1oz) | 35 μm |
This stackup ensures optimal signal integrity, thermal management, and mechanical stability.
4. Key Features of Rogers RO3010
5. Applications of the 4-Layer PCB
Why Choose Bicheng Technologies?
At Bicheng Technologies Limited, we specialize in delivering high-quality PCBs designed to meet the demands of modern technology. Our 4-layer PCB with Rogers RO3010 material is manufactured with precision to ensure superior performance and reliability.
What Sets Us Apart?
If you have any questions or need assistance, feel free to contact me at sales30@bichengpcb.com. Let us help you turn your innovative ideas into reality!
MOQ: | 1 peça |
preço: | 0.99-99USD/PCS |
embalagem padrão: | Embalagem |
Período de entrega: | 2-10 dias úteis |
método de pagamento: | T/T, PayPal |
Capacidade de abastecimento: | 50000 peças |
RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin and no solder mask
Hi, I’m excited to introduce one of our premium products: the 4-layer PCB with Rogers RO3010 material. This PCB is designed for high-frequency applications, offering exceptional mechanical and electrical stability, making it ideal for circuit miniaturization and broadband components. With its 2.7mm thickness, immersion tin finish, and blind vias, this PCB is an excellent choice for industries like automotive radar, telecommunications, and satellite communication.
1. Overview of the 4-Layer PCB
Our 4-layer PCB is built with Rogers RO3010 material, a ceramic-filled PTFE composite that provides a high dielectric constant (Dk) of 10.2 ± 0.30 at 10 GHz. This material ensures low loss, dimensional stability, and thermal reliability, making it perfect for compact and high-performance designs.
The PCB has a finished thickness of 2.7mm, with 1oz copper weight on all layers for consistent signal transmission. The blind vias (L1-L2) allow for efficient layer interconnectivity while maintaining the integrity of the signal paths. The immersion tin surface finish ensures excellent solderability and long-term reliability.
2. PCB Construction Details
Parameter | Specification |
Base Material | Rogers RO3010 |
Layer Count | 4 layers |
Board Dimensions | 35mm x 42mm |
Minimum Trace/Space | 6/9 mils |
Minimum Hole Size | 0.4mm |
Via Type | Blind vias (L1-L2) |
Finished Board Thickness | 2.7mm |
Finished Copper Weight | 1oz (1.4 mils) outer layers |
Via Plating Thickness | 20 μm |
Surface Finish | Immersion Tin |
Top Solder Mask | None |
Bottom Solder Mask | None |
Top Silkscreen | None |
Bottom Silkscreen | None |
Electrical Testing | 100% tested to IPC-Class-2 standards |
3. PCB Stackup
Layer | Material | Thickness |
Copper Layer 1 | Copper (1oz) | 35 μm |
Core Material | Rogers RO3010 Substrate | 1.27mm |
Copper Layer 2 | Copper (1oz) | 35 μm |
Bonding Layer | Prepreg 1060 x 1 | 0.05mm |
Copper Layer 3 | Copper (1oz) | 35 μm |
Core Material | Rogers RO3010 Substrate | 1.27mm |
Copper Layer 4 | Copper (1oz) | 35 μm |
This stackup ensures optimal signal integrity, thermal management, and mechanical stability.
4. Key Features of Rogers RO3010
5. Applications of the 4-Layer PCB
Why Choose Bicheng Technologies?
At Bicheng Technologies Limited, we specialize in delivering high-quality PCBs designed to meet the demands of modern technology. Our 4-layer PCB with Rogers RO3010 material is manufactured with precision to ensure superior performance and reliability.
What Sets Us Apart?
If you have any questions or need assistance, feel free to contact me at sales30@bichengpcb.com. Let us help you turn your innovative ideas into reality!