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RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask

RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask

MOQ: 1 peça
preço: 0.99-99USD/PCS
embalagem padrão: Embalagem
Período de entrega: 2-10 dias úteis
método de pagamento: T/T, PayPal
Capacidade de abastecimento: 50000 peças
Informações detalhadas
Lugar de origem
China
Marca
Rogers
Certificação
ISO9001
Número do modelo
RO3010
Tipo de placa:
PCB de 4 camadas
Testes:
E-teste
Tamanho mínimo do buraco:
0.2 mm
cor silkscreen:
branco
Produto Tela de seda:
Branco, Preto, Amarelo
Espaçamento mínimo entre os traços:
0.1 mm
Método de transporte:
DHL/FedEx/UPS
Material Base:
Calço de aço inoxidável
Min. Traça/espaço:
0.1 mm
Cor de Coverlay:
Preto
Suporte ao cliente:
Assistência ao cliente 24 horas por dia
Peso de cobre:
1OZ
Número de camadas:
4
Máscara de solda:
Verde
Plataforma:
Baseado na Web
Quantidade de ordem mínima:
1 peça
Preço:
0.99-99USD/PCS
Detalhes da embalagem:
Embalagem
Tempo de entrega:
2-10 dias úteis
Termos de pagamento:
T/T, PayPal
Habilidade da fonte:
50000 peças
Descrição do produto

RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask
 
 
Hi, I’m excited to introduce one of our premium products: the 4-layer PCB with Rogers RO3010 material. This PCB is designed for high-frequency applications, offering exceptional mechanical and electrical stability, making it ideal for circuit miniaturization and broadband components. With its 2.7mm thickness, immersion tin finish, and blind vias, this PCB is an excellent choice for industries like automotive radar, telecommunications, and satellite communication.
 
RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask 0
 
1. Overview of the 4-Layer PCB
Our 4-layer PCB is built with Rogers RO3010 material, a ceramic-filled PTFE composite that provides a high dielectric constant (Dk) of 10.2 ± 0.30 at 10 GHz. This material ensures low loss, dimensional stability, and thermal reliability, making it perfect for compact and high-performance designs.
The PCB has a finished thickness of 2.7mm, with 1oz copper weight on all layers for consistent signal transmission. The blind vias (L1-L2) allow for efficient layer interconnectivity while maintaining the integrity of the signal paths. The immersion tin surface finish ensures excellent solderability and long-term reliability.
 
 
2. PCB Construction Details

ParameterSpecification
Base MaterialRogers RO3010
Layer Count4 layers
Board Dimensions35mm x 42mm
Minimum Trace/Space6/9 mils
Minimum Hole Size0.4mm
Via TypeBlind vias (L1-L2)
Finished Board Thickness2.7mm
Finished Copper Weight1oz (1.4 mils) outer layers
Via Plating Thickness20 μm
Surface FinishImmersion Tin
Top Solder MaskNone
Bottom Solder MaskNone
Top SilkscreenNone
Bottom SilkscreenNone
Electrical Testing100% tested to IPC-Class-2 standards

 
 
 
3. PCB Stackup

LayerMaterialThickness
Copper Layer 1Copper (1oz)35 μm
Core MaterialRogers RO3010 Substrate1.27mm
Copper Layer 2Copper (1oz)35 μm
Bonding LayerPrepreg 1060 x 10.05mm
Copper Layer 3Copper (1oz)35 μm
Core MaterialRogers RO3010 Substrate1.27mm
Copper Layer 4Copper (1oz)35 μm

 
This stackup ensures optimal signal integrity, thermal management, and mechanical stability.
RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask 1
 
4. Key Features of Rogers RO3010
 

  • Dielectric Constant (Dk): 10.2 ± 0.30 at 10 GHz, enabling efficient circuit miniaturization.
  • Dissipation Factor (Df): 0.0022 at 10 GHz, ensuring minimal signal loss.
  • Thermal Stability:
  • Decomposition Temperature (Td) > 500°C for reliability in high-heat environments.
  • Thermal Conductivity: 0.95 W/mK for effective heat dissipation.
  • Dimensional Stability:
  • Low CTE: 13 ppm/°C (X), 11 ppm/°C (Y), 16 ppm/°C (Z), ensuring compatibility with copper.
  • Moisture Absorption: 0.05%, making it reliable in humid conditions.

 
 
 
5. Applications of the 4-Layer PCB

  • Automotive Radar Systems
  • Global Positioning Satellite (GPS) Antennas
  • Cellular Telecommunications Systems
  • Patch Antennas for Wireless Communications
  • Satellite Communications
  • Remote Meter Readers
  • Power Backplanes

 
 
Why Choose Bicheng Technologies?
At Bicheng Technologies Limited, we specialize in delivering high-quality PCBs designed to meet the demands of modern technology. Our 4-layer PCB with Rogers RO3010 material is manufactured with precision to ensure superior performance and reliability.
 
 
 
What Sets Us Apart?

  1. High Standards: All PCBs are produced to IPC-Class-2 standards and undergo rigorous testing to ensure quality.
  2. Global Availability: We deliver worldwide, ensuring timely support for your projects.
  3. Customer Support: We work closely with clients to provide customized solutions for their specific needs.

 
 
If you have any questions or need assistance, feel free to contact me at sales30@bichengpcb.com. Let us help you turn your innovative ideas into reality!
 

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Detalhes dos produtos
RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask
MOQ: 1 peça
preço: 0.99-99USD/PCS
embalagem padrão: Embalagem
Período de entrega: 2-10 dias úteis
método de pagamento: T/T, PayPal
Capacidade de abastecimento: 50000 peças
Informações detalhadas
Lugar de origem
China
Marca
Rogers
Certificação
ISO9001
Número do modelo
RO3010
Tipo de placa:
PCB de 4 camadas
Testes:
E-teste
Tamanho mínimo do buraco:
0.2 mm
cor silkscreen:
branco
Produto Tela de seda:
Branco, Preto, Amarelo
Espaçamento mínimo entre os traços:
0.1 mm
Método de transporte:
DHL/FedEx/UPS
Material Base:
Calço de aço inoxidável
Min. Traça/espaço:
0.1 mm
Cor de Coverlay:
Preto
Suporte ao cliente:
Assistência ao cliente 24 horas por dia
Peso de cobre:
1OZ
Número de camadas:
4
Máscara de solda:
Verde
Plataforma:
Baseado na Web
Quantidade de ordem mínima:
1 peça
Preço:
0.99-99USD/PCS
Detalhes da embalagem:
Embalagem
Tempo de entrega:
2-10 dias úteis
Termos de pagamento:
T/T, PayPal
Habilidade da fonte:
50000 peças
Descrição do produto

RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask
 
 
Hi, I’m excited to introduce one of our premium products: the 4-layer PCB with Rogers RO3010 material. This PCB is designed for high-frequency applications, offering exceptional mechanical and electrical stability, making it ideal for circuit miniaturization and broadband components. With its 2.7mm thickness, immersion tin finish, and blind vias, this PCB is an excellent choice for industries like automotive radar, telecommunications, and satellite communication.
 
RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask 0
 
1. Overview of the 4-Layer PCB
Our 4-layer PCB is built with Rogers RO3010 material, a ceramic-filled PTFE composite that provides a high dielectric constant (Dk) of 10.2 ± 0.30 at 10 GHz. This material ensures low loss, dimensional stability, and thermal reliability, making it perfect for compact and high-performance designs.
The PCB has a finished thickness of 2.7mm, with 1oz copper weight on all layers for consistent signal transmission. The blind vias (L1-L2) allow for efficient layer interconnectivity while maintaining the integrity of the signal paths. The immersion tin surface finish ensures excellent solderability and long-term reliability.
 
 
2. PCB Construction Details

ParameterSpecification
Base MaterialRogers RO3010
Layer Count4 layers
Board Dimensions35mm x 42mm
Minimum Trace/Space6/9 mils
Minimum Hole Size0.4mm
Via TypeBlind vias (L1-L2)
Finished Board Thickness2.7mm
Finished Copper Weight1oz (1.4 mils) outer layers
Via Plating Thickness20 μm
Surface FinishImmersion Tin
Top Solder MaskNone
Bottom Solder MaskNone
Top SilkscreenNone
Bottom SilkscreenNone
Electrical Testing100% tested to IPC-Class-2 standards

 
 
 
3. PCB Stackup

LayerMaterialThickness
Copper Layer 1Copper (1oz)35 μm
Core MaterialRogers RO3010 Substrate1.27mm
Copper Layer 2Copper (1oz)35 μm
Bonding LayerPrepreg 1060 x 10.05mm
Copper Layer 3Copper (1oz)35 μm
Core MaterialRogers RO3010 Substrate1.27mm
Copper Layer 4Copper (1oz)35 μm

 
This stackup ensures optimal signal integrity, thermal management, and mechanical stability.
RO3010 4-layer rigid PCB 2.6mm Thick with Immersion Tin​ and no solder mask 1
 
4. Key Features of Rogers RO3010
 

  • Dielectric Constant (Dk): 10.2 ± 0.30 at 10 GHz, enabling efficient circuit miniaturization.
  • Dissipation Factor (Df): 0.0022 at 10 GHz, ensuring minimal signal loss.
  • Thermal Stability:
  • Decomposition Temperature (Td) > 500°C for reliability in high-heat environments.
  • Thermal Conductivity: 0.95 W/mK for effective heat dissipation.
  • Dimensional Stability:
  • Low CTE: 13 ppm/°C (X), 11 ppm/°C (Y), 16 ppm/°C (Z), ensuring compatibility with copper.
  • Moisture Absorption: 0.05%, making it reliable in humid conditions.

 
 
 
5. Applications of the 4-Layer PCB

  • Automotive Radar Systems
  • Global Positioning Satellite (GPS) Antennas
  • Cellular Telecommunications Systems
  • Patch Antennas for Wireless Communications
  • Satellite Communications
  • Remote Meter Readers
  • Power Backplanes

 
 
Why Choose Bicheng Technologies?
At Bicheng Technologies Limited, we specialize in delivering high-quality PCBs designed to meet the demands of modern technology. Our 4-layer PCB with Rogers RO3010 material is manufactured with precision to ensure superior performance and reliability.
 
 
 
What Sets Us Apart?

  1. High Standards: All PCBs are produced to IPC-Class-2 standards and undergo rigorous testing to ensure quality.
  2. Global Availability: We deliver worldwide, ensuring timely support for your projects.
  3. Customer Support: We work closely with clients to provide customized solutions for their specific needs.

 
 
If you have any questions or need assistance, feel free to contact me at sales30@bichengpcb.com. Let us help you turn your innovative ideas into reality!
 

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