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TLY-3 Copper-Clad Laminate with substrate core 0.25mm, 0.76mm, 1.52mm using for antena RF PCB

TLY-3 Copper-Clad Laminate with substrate core 0.25mm, 0.76mm, 1.52mm using for antena RF PCB

MOQ: 1 unidade
preço: 0.99-99USD/PCS
embalagem padrão: Embalagem
Período de entrega: 2-10 dias úteis
método de pagamento: T/T, PayPal
Capacidade de abastecimento: 50000 unidades
Informações detalhadas
Lugar de origem
China
Marca
Taconic
Certificação
ISO9001
Número do modelo
TLY-3
Quantidade de ordem mínima:
1 unidade
Preço:
0.99-99USD/PCS
Detalhes da embalagem:
Embalagem
Tempo de entrega:
2-10 dias úteis
Termos de pagamento:
T/T, PayPal
Habilidade da fonte:
50000 unidades
Descrição do produto

TLY-3 Copper-Clad Laminate: The Superior Choice for Dimensionally Stable, Low-Loss High-Frequency Circuits

We are proud to present TLY-3, an Avionics & Aerospace Grade base material engineered for the most demanding high-frequency and millimeter-wave applications. Manufactured by AGC, TLY-3 is specifically designed to overcome the limitations of traditional PTFE composites, offering an unmatched combination of dimensional stability, ultra-low loss, and manufacturability that directly translates into higher yields and more reliable end products.


Engineered for Stability and Performance
The defining feature of TLY-3 is its unique reinforcement: very lightweight woven fiberglass. Unlike randomly oriented chopped fibers, this woven matrix provides exceptional dimensional stability, minimizing movement during thermal processing. This results in superior registration for multilayer boards and complex circuits, dramatically reducing scrap and improving production yields in high-volume manufacturing environments. Electrically, TLY-3 delivers a stable dielectric constant of 2.33 ± 0.02 at 10 GHz and a low dissipation factor of 0.0012. This excellent electrical performance, confirmed by OEM testing at 77 GHz, enables successful deployment in sensitive applications like automotive radar (77 GHz), satellite communications, and antennas operating into Ka, E, and W bands.

 

 

Properties Conditions Typical Value Unit Test Method
Electrical Properties
Dielectric Constant @ 10 GHz 2.33 ± 0.02   IPC-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0012   IPC-650 2.5.5.5
Volume Resistivity   1010 Mohms/cm IPC-650 2.5.17.1 (after elevated temp.)
  1010 Mohms/cm IPC-650 2.5.17.1 (after humidity)
Surface Resistivity   108 Mohms IPC-650 2.5.17.1 (after elevated temp.)
  108 Mohms IPC-650 2.5.17.1 (after humidity)
Thermal Properties
Thermal Conductivity   0.22 W/M*K ASTM F 433
CTE (25-260°C) X 26 ppm/°C ASTM D 3386 (TMA)
Y 15
Z 217
TLY-3 Copper-Clad Laminate with substrate core 0.25mm, 0.76mm, 1.52mm using for antena RF PCB 0Mechanical Properties
  1/2 oz. ED copper 1.96 (11) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength 1 oz. CL1 copper 2.86 (16) N/mm (Ibs/in)
  1 oz. C1 copper 3.04 (17) N/mm (Ibs/in)
    2.32 (13) N/mm (Ibs/in) IPC-650 2.4.8 (at elevated temp.)
Flexural Strength MD 96.91 (14,057) N/mm2 (psi) IPC-650 2.4.4
CD 89.32 (12,955) N/mm2 (psi)
Young’s Modulus MD 9.65 X 103 N/mm2 (psi) ASTM D 3039 / IPC-650 2.4.19
(1.4 X 106)
Poisson’s Ratio MD 0.21   ASTM D 3039 / IPC-650 2.4.19
Density Specific Gravity 2.19 g/cm3 ASTM D 792
Dimensional Stability MD, 10 mil -0.038 mm/M (mils/in) IPC-650 2.4.39
CD, 10 mil -0.038 mm/M (mils/in) (avg. after bake & thermal stress)
Chemical / Physical Properties
Moisture Absorption   0.02 % IPC-650 2.6.2.1
NASA Outgassing TML 0.01 %  
CVCM 0.01 %  
WVR 0.01 %  
UL-94 Flammability Rating   V-0   UL-94

 

Robust and Reliable Material Properties
TLY-3 is built to perform under rigorous conditions. It exhibits an extremely low moisture absorption of 0.02%, ensuring stable performance in humid environments. The material boasts exceptionally high peel strength, with values reaching up to 3.04 N/mm (17 lbs/in) for 1 oz copper, ensuring outstanding reliability for plated through-holes and surface-mounted components. Its excellent dimensional stability (as low as -0.038 mm/m) and favorable Coefficient of Thermal Expansion (CTE) profile further enhance manufacturing predictability and long-term reliability. TLY-3 is also laser ablatable for precise via formation and carries a UL 94 V-0 flammability rating, meeting stringent safety standards for aerospace and automotive applications.


Flexible Variant: TLY-3FF
For designs requiring conformability or installation with a bend radius, we also offer TLY-3FF. This highly flexible variant maintains the low-loss and stable Dk benefits of standard TLY-3 but with a flexibility comparable to chopped fiber laminates, making it ideal for curved antennas or assemblies.


Standard Product Configurations

Standard Thicknesses: Available from ultra-thin 0.0035" (0.09mm) up to 0.060" (1.52mm), with manufacturing possible in 0.005" (0.125mm) increments.

Standard Panel Sizes: The standard size is 18" x 24" (457mm x 610mm). Other sizes, including 12"x18", 16"x36", and 18"x48", are also available.

Cladding Options: Compatible with various copper foil types and weights, including ½ oz and 1 oz electrodeposited (ED) copper.


TLY-3 is Ideal for Critical Applications
1.) Automotive Radar Sensors (76-81 GHz)
2.) Phased Array Antennas for aerospace and defense
3.) Satellite Up/Down Converters and LNBs/LNAs
4.) High-Frequency Power Amplifiers
5.) Filters and Couplers in communication systems


When your design requires a material that bridges the gap between the electrical performance of low-Dk laminates and the mechanical robustness needed for reliable, high-yield manufacturing, TLY-3 is the clear solution. Contact us today to discuss your project specifications, request material samples, or receive a quotation. Our technical team is ready to support your success with this high-performance laminate.


 

produtos
Detalhes dos produtos
TLY-3 Copper-Clad Laminate with substrate core 0.25mm, 0.76mm, 1.52mm using for antena RF PCB
MOQ: 1 unidade
preço: 0.99-99USD/PCS
embalagem padrão: Embalagem
Período de entrega: 2-10 dias úteis
método de pagamento: T/T, PayPal
Capacidade de abastecimento: 50000 unidades
Informações detalhadas
Lugar de origem
China
Marca
Taconic
Certificação
ISO9001
Número do modelo
TLY-3
Quantidade de ordem mínima:
1 unidade
Preço:
0.99-99USD/PCS
Detalhes da embalagem:
Embalagem
Tempo de entrega:
2-10 dias úteis
Termos de pagamento:
T/T, PayPal
Habilidade da fonte:
50000 unidades
Descrição do produto

TLY-3 Copper-Clad Laminate: The Superior Choice for Dimensionally Stable, Low-Loss High-Frequency Circuits

We are proud to present TLY-3, an Avionics & Aerospace Grade base material engineered for the most demanding high-frequency and millimeter-wave applications. Manufactured by AGC, TLY-3 is specifically designed to overcome the limitations of traditional PTFE composites, offering an unmatched combination of dimensional stability, ultra-low loss, and manufacturability that directly translates into higher yields and more reliable end products.


Engineered for Stability and Performance
The defining feature of TLY-3 is its unique reinforcement: very lightweight woven fiberglass. Unlike randomly oriented chopped fibers, this woven matrix provides exceptional dimensional stability, minimizing movement during thermal processing. This results in superior registration for multilayer boards and complex circuits, dramatically reducing scrap and improving production yields in high-volume manufacturing environments. Electrically, TLY-3 delivers a stable dielectric constant of 2.33 ± 0.02 at 10 GHz and a low dissipation factor of 0.0012. This excellent electrical performance, confirmed by OEM testing at 77 GHz, enables successful deployment in sensitive applications like automotive radar (77 GHz), satellite communications, and antennas operating into Ka, E, and W bands.

 

 

Properties Conditions Typical Value Unit Test Method
Electrical Properties
Dielectric Constant @ 10 GHz 2.33 ± 0.02   IPC-650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0012   IPC-650 2.5.5.5
Volume Resistivity   1010 Mohms/cm IPC-650 2.5.17.1 (after elevated temp.)
  1010 Mohms/cm IPC-650 2.5.17.1 (after humidity)
Surface Resistivity   108 Mohms IPC-650 2.5.17.1 (after elevated temp.)
  108 Mohms IPC-650 2.5.17.1 (after humidity)
Thermal Properties
Thermal Conductivity   0.22 W/M*K ASTM F 433
CTE (25-260°C) X 26 ppm/°C ASTM D 3386 (TMA)
Y 15
Z 217
TLY-3 Copper-Clad Laminate with substrate core 0.25mm, 0.76mm, 1.52mm using for antena RF PCB 0Mechanical Properties
  1/2 oz. ED copper 1.96 (11) N/mm (Ibs/in) IPC-650 2.4.8
Peel Strength 1 oz. CL1 copper 2.86 (16) N/mm (Ibs/in)
  1 oz. C1 copper 3.04 (17) N/mm (Ibs/in)
    2.32 (13) N/mm (Ibs/in) IPC-650 2.4.8 (at elevated temp.)
Flexural Strength MD 96.91 (14,057) N/mm2 (psi) IPC-650 2.4.4
CD 89.32 (12,955) N/mm2 (psi)
Young’s Modulus MD 9.65 X 103 N/mm2 (psi) ASTM D 3039 / IPC-650 2.4.19
(1.4 X 106)
Poisson’s Ratio MD 0.21   ASTM D 3039 / IPC-650 2.4.19
Density Specific Gravity 2.19 g/cm3 ASTM D 792
Dimensional Stability MD, 10 mil -0.038 mm/M (mils/in) IPC-650 2.4.39
CD, 10 mil -0.038 mm/M (mils/in) (avg. after bake & thermal stress)
Chemical / Physical Properties
Moisture Absorption   0.02 % IPC-650 2.6.2.1
NASA Outgassing TML 0.01 %  
CVCM 0.01 %  
WVR 0.01 %  
UL-94 Flammability Rating   V-0   UL-94

 

Robust and Reliable Material Properties
TLY-3 is built to perform under rigorous conditions. It exhibits an extremely low moisture absorption of 0.02%, ensuring stable performance in humid environments. The material boasts exceptionally high peel strength, with values reaching up to 3.04 N/mm (17 lbs/in) for 1 oz copper, ensuring outstanding reliability for plated through-holes and surface-mounted components. Its excellent dimensional stability (as low as -0.038 mm/m) and favorable Coefficient of Thermal Expansion (CTE) profile further enhance manufacturing predictability and long-term reliability. TLY-3 is also laser ablatable for precise via formation and carries a UL 94 V-0 flammability rating, meeting stringent safety standards for aerospace and automotive applications.


Flexible Variant: TLY-3FF
For designs requiring conformability or installation with a bend radius, we also offer TLY-3FF. This highly flexible variant maintains the low-loss and stable Dk benefits of standard TLY-3 but with a flexibility comparable to chopped fiber laminates, making it ideal for curved antennas or assemblies.


Standard Product Configurations

Standard Thicknesses: Available from ultra-thin 0.0035" (0.09mm) up to 0.060" (1.52mm), with manufacturing possible in 0.005" (0.125mm) increments.

Standard Panel Sizes: The standard size is 18" x 24" (457mm x 610mm). Other sizes, including 12"x18", 16"x36", and 18"x48", are also available.

Cladding Options: Compatible with various copper foil types and weights, including ½ oz and 1 oz electrodeposited (ED) copper.


TLY-3 is Ideal for Critical Applications
1.) Automotive Radar Sensors (76-81 GHz)
2.) Phased Array Antennas for aerospace and defense
3.) Satellite Up/Down Converters and LNBs/LNAs
4.) High-Frequency Power Amplifiers
5.) Filters and Couplers in communication systems


When your design requires a material that bridges the gap between the electrical performance of low-Dk laminates and the mechanical robustness needed for reliable, high-yield manufacturing, TLY-3 is the clear solution. Contact us today to discuss your project specifications, request material samples, or receive a quotation. Our technical team is ready to support your success with this high-performance laminate.


 

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