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4-Layer Hybrid High-Frequency PCB – RO4003C + FR4 (Immersion Gold) Copper Clad Laminates

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4-Layer Hybrid High-Frequency PCB – RO4003C + FR4 (Immersion Gold) Copper Clad Laminates

MOQ:	1 unidade
preço:	1.99USD/pcs
embalagem padrão:	embalagem
Período de entrega:	2 a 10 dias úteis
método de pagamento:	T/T, Paypal
Capacidade de abastecimento:	50000PCS

Informações detalhadas

Descrição do produto

Informações detalhadas

Lugar de origem

China

Marca

Rogers

Certificação

ISO9001

Número do modelo

RO4003C+FR4

Quantidade de ordem mínima:

1 unidade

Preço:

1.99USD/pcs

Detalhes da embalagem:

embalagem

Tempo de entrega:

2 a 10 dias úteis

Termos de pagamento:

T/T, Paypal

Habilidade da fonte:

50000PCS

Descrição do produto

4-Layer Hybrid High-Frequency PCB – RO4003C + FR4 (Immersion Gold)

We present our 4-Layer RO4003C + FR4 Hybrid PCB – a high-performance, cost-effective solution for RF and microwave circuits requiring controlled impedance, low loss, and reliable thermal performance. The top signal layers utilize Rogers RO4003C hydrocarbon ceramic laminate (Dk 3.38 ±0.05, Df 0.0027 @ 10 GHz), while the bottom layers use FR4 (TG175) for mechanical rigidity and cost optimization. This hybrid construction is finished with Immersion Gold (2µ") , green solder mask, and white silkscreen. The board includes controlled depth slots and meets IPC-6012 Class 3 reliability standards, with 25µm copper plating in each hole.

Key Specifications

Parameter	Details
Product Type	4-Layer Hybrid High-Frequency PCB
Base Materials	RO4003C (Top RF section) + FR4 TG175 (Bottom section)
Finished Board Thickness	1.4 mm
Board Dimensions	200 mm × 115 mm = 1 piece
Inner Layer Copper Weight	0.5 oz (17.5 μm)
Outer Layer Copper Weight	1 oz (35 μm) finished
Solder Mask	Green (Top & Bottom)
Silkscreen	White (Top)
Surface Finish	Immersion Gold (ENIG) – 2 microinches (0.05 μm) gold thickness
Via Plating Thickness	25 μm (1 mil) minimum in each hole
Special Features	Controlled depth slots (routing)
Quality Standard	IPC-6012 Class 3 (High reliability)
Electrical Test	100% prior to shipment
Artwork Format	Gerber RS-274-X

PCB Stackup (4-Layer Hybrid Rigid)

4-Layer Hybrid High-Frequency PCB – RO4003C + FR4 (Immersion Gold) Copper Clad Laminates 0

What is RO4003C?

RO4003C™ is a hydrocarbon ceramic laminate from Rogers Corporation, designed to offer superior high-frequency performance with the ability to be fabricated using standard FR-4 epoxy/glass processing techniques. Unlike PTFE-based materials, RO4003C is a rigid thermoset laminate that does not require specialized via preparation (e.g., sodium etch) and is compatible with automated handling systems.

RO4003C is part of the RO4000® series, which includes RO4350B™ (higher Dk for miniaturization) and RO4835™ (enhanced oxidation resistance).

Key Properties of RO4003C

Property	Typical Value	Condition	Test Method
Dielectric Constant (Dk) – Process	3.38 ±0.05	10 GHz / 23°C	IPC-TM-650 2.5.5.5
Dielectric Constant (Dk) – Design	3.55	8–40 GHz	Differential Phase Length
Dissipation Factor (Df)	0.0027	10 GHz / 23°C	IPC-TM-650 2.5.5.5
Dissipation Factor (Df)	0.0021	2.5 GHz / 23°C	IPC-TM-650 2.5.5.5
Thermal Coefficient of Dk (TCDk)	+40 ppm/°C	-50°C to 150°C	IPC-TM-650 2.5.5.5
Volume Resistivity	1.7 × 10¹⁰ MΩ·cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	4.2 × 10⁹ MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2 KV/mm (780 V/mil)	0.51 mm (0.020")	IPC-TM-650 2.5.6.2
Tensile Modulus (X)	19,650 MPa (2,850 ksi)	RT	ASTM D638
Tensile Modulus (Y)	19,450 MPa (2,821 ksi)	RT	ASTM D638
Tensile Strength (X)	139 MPa (20.2 ksi)	RT	ASTM D638
Tensile Strength (Y)	100 MPa (14.5 ksi)	RT	ASTM D638
Flexural Strength	276 MPa (40 kpsi)	–	IPC-TM-650 2.4.4
Dimensional Stability	<0.3 mm/m (<0.3 mils/inch)	After etch + E2/150°C	IPC-TM-650 2.4.39A
CTE – X axis	11 ppm/°C	-55 to 288°C	IPC-TM-650 2.4.41
CTE – Y axis	14 ppm/°C	-55 to 288°C	IPC-TM-650 2.4.41
CTE – Z axis	46 ppm/°C	-55 to 288°C	IPC-TM-650 2.4.41
Tg (TMA)	>280°C	A	IPC-TM-650 2.4.24.3
Td (TGA)	425°C	–	ASTM D3850
Thermal Conductivity	0.71 W/m/°K	80°C	ASTM C518
Moisture Absorption	0.06%	48 hrs immersion, 50°C	ASTM D570
Density	1.79 g/cm³	23°C	ASTM D792
Copper Peel Strength	1.05 N/mm (6.0 pli)	After solder float, 1 oz ED	IPC-TM-650 2.4.8
Flammability	N/A (RO4350B is UL 94 V-0)	–	UL 94
Lead-Free Process Compatible	Yes	–	–

Standard Thicknesses Available for RO4003C

Thickness (inches)	Thickness (mm)	Tolerance
0.008"	0.203 mm	±0.0010"
0.012"	0.305 mm	±0.0010"
0.016"	0.406 mm	±0.0015"
0.020"	0.508 mm	±0.0015"
0.032"	0.813 mm	±0.0020"
0.060"	1.524 mm	±0.0040"

Key Advantages of RO4003C

FR-4 Compatible Processing – Can be fabricated using standard epoxy/glass (FR-4) processes. No specialized via preparation (sodium etch) required.

Stable Dk over Temperature & Frequency – TCDk of +40 ppm/°C is among the lowest of any circuit board material. Dk remains stable from 500 MHz to 40 GHz.

Low Dielectric Loss (Df 0.0027 @ 10 GHz) – Enables use in applications where higher frequencies limit conventional laminates.

Copper-Matched CTE – X/Y CTE of 11–14 ppm/°C closely matches copper (17 ppm/°C), providing excellent dimensional stability and reliable plated through-holes.

High Tg (>280°C) – Expansion characteristics remain stable over entire circuit processing temperature range.

Low Z-axis CTE (46 ppm/°C) – Ensures reliable PTH quality even in severe thermal shock applications.

Typical Applications of RO4003C

Cellular base station power amplifiers & antennas

RF identification (RFID) tags

Satellite radio antennas (SDARS)

Automotive radar (ADAS)

Microwave point-to-point backhaul radios

High-speed digital backplanes

Test & measurement equipment

What is a High-Frequency Hybrid PCB?

A High-Frequency Hybrid PCB is a multilayer printed circuit board that combines two or more different dielectric materials in a single stackup – typically a high-performance RF laminate (e.g., RO4003C) for signal layers and a standard or mid-performance material (e.g., FR4) for non-critical layers.

In this product:

RO4003C is used on Layer 1–2 (top RF section) for low loss, stable Dk, and controlled impedance.

FR4 TG175 is used on Layer 3–4 (bottom section) for mechanical support, power distribution, and cost reduction.

Why Use a Hybrid Construction?

Driver	Explanation
Cost Optimization	High-frequency materials (RO4003C) are expensive. FR4 is significantly cheaper. Using FR4 for non-critical layers reduces total board cost.
Mechanical Rigidity	FR4 provides excellent mechanical strength and is well-suited for thick boards, connectors, and large form factors.
Thermal Management	Hybrid stackups can be designed to place heat-generating components on the FR4 side with thermal vias to copper planes.
Design Flexibility	Allows RF performance where needed (top layers) and standard digital/DC routing where performance requirements are lower (bottom layers).
Manufacturing Compatibility	FR4 is universally understood by PCB fabricators. Hybrid boards can be processed with modifications to standard FR4 lines.
Advantages of High-Frequency Hybrid PCBs
Advantage	Description
Cost-Effective	Reduces material cost by 30–60% compared to all-high-frequency laminates.
Excellent RF Performance	Critical signal layers use low-loss, stable Dk materials.
Good Thermal Reliability	RO4003C has Tg >280°C; FR4 TG175 supports lead-free assembly.
Standard Fabrication	RO4003C is FR4-process-compatible – no PTFE-specific handling.
Reliable PTH	Low Z-axis CTE of RO4003C (46 ppm/°C) combined with matched CTE to copper ensures via reliability.
Mixed Component Placement	High-frequency components (RFICs, antennas) on RO4003C side; digital ICs, passives, connectors on FR4 side.

Disadvantages / Challenges of High-Frequency Hybrid PCBs

Disadvantage	Description	Mitigation
Registration Control	Different CTE values between RO4003C (11–14 ppm/°C) and FR4 (14–18 ppm/°C) can cause layer-to-layer misregistration during lamination.	Use matched prepreg systems; optimize lamination cycle.
Z-axis CTE Mismatch	RO4003C Z-CTE = 46 ppm/°C; FR4 Z-CTE = 50–60 ppm/°C. Differential expansion stresses plated vias crossing the hybrid interface.	Use ductile copper plating (25μm min); avoid vias directly at material transition.
Bonding Reliability	Adhesion between RO4003C and FR4 requires careful prepreg selection (e.g., 2113 RC56% used here).	Follow Rogers RO4400 bondply guidelines.
Material Cost	Still higher than all-FR4 boards (but lower than all-high-frequency).	Acceptable trade-off for required RF performance.
Fabrication Complexity	Requires fabricator experienced with hybrid laminates; additional process controls needed.	Partner with qualified suppliers (IPC-6012 Class 3).
Moisture Sensitivity	RO4003C absorbs 0.06% moisture vs. FR4 ~0.1–0.2%. Minimal difference, but baking before assembly recommended.	Standard pre-assembly bake (120°C for 2–4 hours).

When to Choose a Hybrid PCB

RF performance is required only on certain layers

Board size is large – all-high-frequency would be cost-prohibitive

Mechanical strength is needed (connectors, mounting holes)

Mixed-signal design (RF + high-speed digital + DC power)

Volume production – hybrid balances performance and cost

Choose all-high-frequency when:

All signal layers require low loss and stable Dk

Budget allows for premium material

Design is very sensitive to CTE mismatch (e.g., high-density interconnects)

Ordering Information

Submit your Gerber RS-274-X files and fabrication drawings with clear indication of:

Controlled depth slot locations and depths

Impedance control requirements (if any)

Netlist for 100% electrical testing

We support prototype to volume production with global shipping.

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4-Layer Hybrid High-Frequency PCB – RO4003C + FR4 (Immersion Gold) Copper Clad Laminates

MOQ:	1 unidade
preço:	1.99USD/pcs
embalagem padrão:	embalagem
Período de entrega:	2 a 10 dias úteis
método de pagamento:	T/T, Paypal
Capacidade de abastecimento:	50000PCS

Informações detalhadas

Descrição do produto

Informações detalhadas

Lugar de origem

China

Marca

Rogers

Certificação

ISO9001

Número do modelo

RO4003C+FR4

Quantidade de ordem mínima:

1 unidade

Preço:

1.99USD/pcs

Detalhes da embalagem:

embalagem

Tempo de entrega:

2 a 10 dias úteis

Termos de pagamento:

T/T, Paypal

Habilidade da fonte:

50000PCS

Descrição do produto

4-Layer Hybrid High-Frequency PCB – RO4003C + FR4 (Immersion Gold)

Key Specifications

Parameter	Details
Product Type	4-Layer Hybrid High-Frequency PCB
Base Materials	RO4003C (Top RF section) + FR4 TG175 (Bottom section)
Finished Board Thickness	1.4 mm
Board Dimensions	200 mm × 115 mm = 1 piece
Inner Layer Copper Weight	0.5 oz (17.5 μm)
Outer Layer Copper Weight	1 oz (35 μm) finished
Solder Mask	Green (Top & Bottom)
Silkscreen	White (Top)
Surface Finish	Immersion Gold (ENIG) – 2 microinches (0.05 μm) gold thickness
Via Plating Thickness	25 μm (1 mil) minimum in each hole
Special Features	Controlled depth slots (routing)
Quality Standard	IPC-6012 Class 3 (High reliability)
Electrical Test	100% prior to shipment
Artwork Format	Gerber RS-274-X

PCB Stackup (4-Layer Hybrid Rigid)

4-Layer Hybrid High-Frequency PCB – RO4003C + FR4 (Immersion Gold) Copper Clad Laminates 0

What is RO4003C?

RO4003C is part of the RO4000® series, which includes RO4350B™ (higher Dk for miniaturization) and RO4835™ (enhanced oxidation resistance).

Key Properties of RO4003C

Property	Typical Value	Condition	Test Method
Dielectric Constant (Dk) – Process	3.38 ±0.05	10 GHz / 23°C	IPC-TM-650 2.5.5.5
Dielectric Constant (Dk) – Design	3.55	8–40 GHz	Differential Phase Length
Dissipation Factor (Df)	0.0027	10 GHz / 23°C	IPC-TM-650 2.5.5.5
Dissipation Factor (Df)	0.0021	2.5 GHz / 23°C	IPC-TM-650 2.5.5.5
Thermal Coefficient of Dk (TCDk)	+40 ppm/°C	-50°C to 150°C	IPC-TM-650 2.5.5.5
Volume Resistivity	1.7 × 10¹⁰ MΩ·cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	4.2 × 10⁹ MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2 KV/mm (780 V/mil)	0.51 mm (0.020")	IPC-TM-650 2.5.6.2
Tensile Modulus (X)	19,650 MPa (2,850 ksi)	RT	ASTM D638
Tensile Modulus (Y)	19,450 MPa (2,821 ksi)	RT	ASTM D638
Tensile Strength (X)	139 MPa (20.2 ksi)	RT	ASTM D638
Tensile Strength (Y)	100 MPa (14.5 ksi)	RT	ASTM D638
Flexural Strength	276 MPa (40 kpsi)	–	IPC-TM-650 2.4.4
Dimensional Stability	<0.3 mm/m (<0.3 mils/inch)	After etch + E2/150°C	IPC-TM-650 2.4.39A
CTE – X axis	11 ppm/°C	-55 to 288°C	IPC-TM-650 2.4.41
CTE – Y axis	14 ppm/°C	-55 to 288°C	IPC-TM-650 2.4.41
CTE – Z axis	46 ppm/°C	-55 to 288°C	IPC-TM-650 2.4.41
Tg (TMA)	>280°C	A	IPC-TM-650 2.4.24.3
Td (TGA)	425°C	–	ASTM D3850
Thermal Conductivity	0.71 W/m/°K	80°C	ASTM C518
Moisture Absorption	0.06%	48 hrs immersion, 50°C	ASTM D570
Density	1.79 g/cm³	23°C	ASTM D792
Copper Peel Strength	1.05 N/mm (6.0 pli)	After solder float, 1 oz ED	IPC-TM-650 2.4.8
Flammability	N/A (RO4350B is UL 94 V-0)	–	UL 94
Lead-Free Process Compatible	Yes	–	–

Standard Thicknesses Available for RO4003C

Thickness (inches)	Thickness (mm)	Tolerance
0.008"	0.203 mm	±0.0010"
0.012"	0.305 mm	±0.0010"
0.016"	0.406 mm	±0.0015"
0.020"	0.508 mm	±0.0015"
0.032"	0.813 mm	±0.0020"
0.060"	1.524 mm	±0.0040"

Key Advantages of RO4003C

FR-4 Compatible Processing – Can be fabricated using standard epoxy/glass (FR-4) processes. No specialized via preparation (sodium etch) required.

Stable Dk over Temperature & Frequency – TCDk of +40 ppm/°C is among the lowest of any circuit board material. Dk remains stable from 500 MHz to 40 GHz.

Low Dielectric Loss (Df 0.0027 @ 10 GHz) – Enables use in applications where higher frequencies limit conventional laminates.

Copper-Matched CTE – X/Y CTE of 11–14 ppm/°C closely matches copper (17 ppm/°C), providing excellent dimensional stability and reliable plated through-holes.

High Tg (>280°C) – Expansion characteristics remain stable over entire circuit processing temperature range.

Low Z-axis CTE (46 ppm/°C) – Ensures reliable PTH quality even in severe thermal shock applications.

Typical Applications of RO4003C

Cellular base station power amplifiers & antennas

RF identification (RFID) tags

Satellite radio antennas (SDARS)

Automotive radar (ADAS)

Microwave point-to-point backhaul radios

High-speed digital backplanes

Test & measurement equipment

What is a High-Frequency Hybrid PCB?

In this product:

RO4003C is used on Layer 1–2 (top RF section) for low loss, stable Dk, and controlled impedance.

FR4 TG175 is used on Layer 3–4 (bottom section) for mechanical support, power distribution, and cost reduction.

Why Use a Hybrid Construction?

Driver	Explanation
Cost Optimization	High-frequency materials (RO4003C) are expensive. FR4 is significantly cheaper. Using FR4 for non-critical layers reduces total board cost.
Mechanical Rigidity	FR4 provides excellent mechanical strength and is well-suited for thick boards, connectors, and large form factors.
Thermal Management	Hybrid stackups can be designed to place heat-generating components on the FR4 side with thermal vias to copper planes.
Design Flexibility	Allows RF performance where needed (top layers) and standard digital/DC routing where performance requirements are lower (bottom layers).
Manufacturing Compatibility	FR4 is universally understood by PCB fabricators. Hybrid boards can be processed with modifications to standard FR4 lines.
Advantages of High-Frequency Hybrid PCBs
Advantage	Description
Cost-Effective	Reduces material cost by 30–60% compared to all-high-frequency laminates.
Excellent RF Performance	Critical signal layers use low-loss, stable Dk materials.
Good Thermal Reliability	RO4003C has Tg >280°C; FR4 TG175 supports lead-free assembly.
Standard Fabrication	RO4003C is FR4-process-compatible – no PTFE-specific handling.
Reliable PTH	Low Z-axis CTE of RO4003C (46 ppm/°C) combined with matched CTE to copper ensures via reliability.
Mixed Component Placement	High-frequency components (RFICs, antennas) on RO4003C side; digital ICs, passives, connectors on FR4 side.

Disadvantages / Challenges of High-Frequency Hybrid PCBs

Disadvantage	Description	Mitigation
Registration Control	Different CTE values between RO4003C (11–14 ppm/°C) and FR4 (14–18 ppm/°C) can cause layer-to-layer misregistration during lamination.	Use matched prepreg systems; optimize lamination cycle.
Z-axis CTE Mismatch	RO4003C Z-CTE = 46 ppm/°C; FR4 Z-CTE = 50–60 ppm/°C. Differential expansion stresses plated vias crossing the hybrid interface.	Use ductile copper plating (25μm min); avoid vias directly at material transition.
Bonding Reliability	Adhesion between RO4003C and FR4 requires careful prepreg selection (e.g., 2113 RC56% used here).	Follow Rogers RO4400 bondply guidelines.
Material Cost	Still higher than all-FR4 boards (but lower than all-high-frequency).	Acceptable trade-off for required RF performance.
Fabrication Complexity	Requires fabricator experienced with hybrid laminates; additional process controls needed.	Partner with qualified suppliers (IPC-6012 Class 3).
Moisture Sensitivity	RO4003C absorbs 0.06% moisture vs. FR4 ~0.1–0.2%. Minimal difference, but baking before assembly recommended.	Standard pre-assembly bake (120°C for 2–4 hours).

When to Choose a Hybrid PCB

RF performance is required only on certain layers

Board size is large – all-high-frequency would be cost-prohibitive

Mechanical strength is needed (connectors, mounting holes)

Mixed-signal design (RF + high-speed digital + DC power)

Volume production – hybrid balances performance and cost

Choose all-high-frequency when:

All signal layers require low loss and stable Dk

Budget allows for premium material

Design is very sensitive to CTE mismatch (e.g., high-density interconnects)

Ordering Information

Submit your Gerber RS-274-X files and fabrication drawings with clear indication of:

Controlled depth slot locations and depths

Impedance control requirements (if any)

Netlist for 100% electrical testing

We support prototype to volume production with global shipping.

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