Detalhes dos produtos

Para casa > produtos >

4-Layer Hybrid High-Frequency PCB – RT/duroid 5880 + FR4 (Immersion Gold, Controlled Depth Trench)

produtos

4-Layer Hybrid High-Frequency PCB – RT/duroid 5880 + FR4 (Immersion Gold, Controlled Depth Trench)

MOQ:	1 unidade
preço:	0.99-99USD/PCS
embalagem padrão:	embalagem
Período de entrega:	2 a 10 dias úteis
método de pagamento:	T/T, Paypal
Capacidade de abastecimento:	50000PCS

Informações detalhadas

Descrição do produto

Informações detalhadas

Lugar de origem

China

Marca

Rogers

Certificação

ISO9001

Número do modelo

Quantidade de ordem mínima:

1 unidade

Preço:

0.99-99USD/PCS

Detalhes da embalagem:

embalagem

Tempo de entrega:

2 a 10 dias úteis

Termos de pagamento:

T/T, Paypal

Habilidade da fonte:

50000PCS

Descrição do produto

4-Layer Hybrid High-Frequency PCB – RT/duroid 5880 + FR4 (Immersion Gold, Controlled Depth Trench)

We present our 4-Layer RT/duroid 5880 + FR4 Hybrid PCB – a high-performance, ultra-low-loss circuit board engineered for demanding millimeter-wave, Ku-band, and aerospace applications. The top RF section utilizes Rogers RT/duroid 5880 glass microfiber-reinforced PTFE laminate (Dk 2.20 ±0.02, Df 0.0009 @ 10 GHz), while the bottom layers use High Tg FR4 for mechanical support and cost optimization. This hybrid construction features a 6-layer copper structure (4-layer PCB with additional copper planes), finished with Immersion Gold (2µ") , blue solder mask, and white silkscreen. The board includes controlled depth trenches and meets IPC-6012 Class 3 reliability standards, with 25µm copper plating in each via.

Key Specifications

Parameter	Details
Product Type	4-Layer Hybrid High-Frequency PCB (6-Layer Copper Structure)
Base Materials	RT/duroid 5880 (Top RF section) + High Tg FR4 (Bottom section)
Finished Board Thickness	1.0 mm
Board Dimensions	90 mm × 80 mm = 1 piece
Inner Layer Copper Weight	0.5 oz (17.5 μm)
Outer Layer Copper Weight	1 oz (35 μm) finished
Total Copper Layers	6 (including internal ground/power planes)
Solder Mask	Blue (Top & Bottom)
Silkscreen	White (Top)
Surface Finish	Immersion Gold (ENIG) – 2 microinches (0.05 μm) gold thickness
Via Plating Thickness	25 μm (1 mil) minimum in each hole
Special Features	Controlled depth trench (routed cavity / channel)
Quality Standard	IPC-6012 Class 3 (High Reliability)
Electrical Test	100% prior to shipment
Artwork Format	Gerber RS-274-X

PCB Stackup (4-Layer with 6-Layer Copper Structure)

4-Layer Hybrid High-Frequency PCB – RT/duroid 5880 + FR4 (Immersion Gold, Controlled Depth Trench) 0

What is RT/duroid 5880?

RT/duroid® 5880 is a glass microfiber-reinforced PTFE composite from Rogers Corporation, designed for exacting stripline and microstrip circuit applications. Unlike woven-glass reinforced materials, the randomly oriented microfibers eliminate Dk variation caused by glass weave effects – delivering exceptional dielectric constant uniformity from panel to panel and across frequency.

With the lowest dissipation factor (0.0009 @ 10 GHz) of any reinforced PTFE material, RT/duroid 5880 extends its usefulness to Ku-band, K-band, Ka-band, and millimeter-wave frequencies (up to 100 GHz+). It is easily cut, sheared, and machined to shape, and resistant to all solvents and reagents used in etching printed circuits or plating edges and holes.

Key Properties of RT/duroid 5880

Property	Typical Value	Condition	Test Method
Dielectric Constant (Dk) – Process	2.20 ±0.02	10 GHz / 23°C	IPC-TM-650 2.5.5.5
Dielectric Constant (Dk) – Design	2.2	8–40 GHz	Differential Phase Length Method
Dissipation Factor (Df)	0.0009	10 GHz / 23°C	IPC-TM-650 2.5.5.5
Dissipation Factor (Df)	0.0004	1 MHz / 23°C	IPC-TM-650 2.5.5.3
Thermal Coefficient of Dk (TCDk)	-125 ppm/°C	-50 to 150°C	IPC-TM-650 2.5.5.5
Volume Resistivity	2 × 10⁷ MΩ·cm	C96/35/90	ASTM D257
Surface Resistivity	3 × 10⁷ MΩ	C96/35/90	ASTM D257
Specific Heat	0.96 J/g/K (0.23 cal/g/°C)	–	Calculated
Tensile Modulus (X @ 23°C)	1,070 MPa (156 kpsi)	A	ASTM D638
Tensile Modulus (Y @ 23°C)	860 MPa (125 kpsi)	A	ASTM D638
Tensile Strength (X @ 23°C)	29 MPa (4.2 kpsi)	A	ASTM D638
Tensile Strength (Y @ 23°C)	27 MPa (3.9 kpsi)	A	ASTM D638
Ultimate Strain (X @ 23°C)	6.00%	A	ASTM D638
Ultimate Strain (Y @ 23°C)	4.90%	A	ASTM D638
Compressive Modulus (Z @ 23°C)	940 MPa (136 kpsi)	A	ASTM D695
Moisture Absorption	0.02%	0.062" (1.6mm), D48/50	ASTM D570
Thermal Conductivity	0.20 W/m/K	80°C	ASTM C518
CTE – X axis	31 ppm/°C	0–100°C	IPC-TM-650 2.4.41
CTE – Y axis	48 ppm/°C	0–100°C	IPC-TM-650 2.4.41
CTE – Z axis	237 ppm/°C	0–100°C	IPC-TM-650 2.4.41
Td (Decomposition Temp.)	500°C	TGA	ASTM D3850
Density	2.2 g/cm³	–	ASTM D792
Copper Peel Strength	31.2 N/mm (5.5 pli)	After solder float, 1 oz EDC	IPC-TM-650 2.4.8
Flammability	V-0	–	UL 94
Lead-Free Process Compatible	Yes	–	–

Standard Thicknesses Available for RT/duroid 5880

Thickness (inches)	Thickness (mm)	Tolerance
0.005"	0.127 mm	±0.0005"
0.010"	0.254 mm	±0.0007"
0.020"	0.508 mm	±0.0015"
0.031"	0.787 mm	±0.0020"
0.062"	1.575 mm	±0.0030"

Additional thicknesses available from 0.0035" to 0.375" in varying increments.

Key Advantages of RT/duroid 5880

Advantage	Description
Ultra-Low Loss (Df 0.0009 @ 10 GHz)	Lowest loss of any reinforced PTFE material – ideal for millimeter-wave (up to 100 GHz+)
Tight Dk Tolerance (±0.02)	Predictable impedance and phase matching – critical for phased arrays
No Glass Weave Effect	Randomly oriented microfibers eliminate Dk variation associated with woven-glass PTFE
Uniform Panel-to-Panel	Consistent electrical properties simplify high-volume production
Wide Frequency Stability	Dk constant from 500 MHz to 40 GHz+
Low Moisture Absorption (0.02%)	Stable electrical performance in humid environments
Process-Friendly	Easily cut, sheared, and machined; resistant to solvents and reagents
Low Out-Gassing	Ideal for space and satellite applications

Typical Applications of RT/duroid 5880

Millimeter-Wave Radar (Automotive, defense, weather)

Phased Array Antennas (5G/6G, satellite, defense)

Commercial Airline Broadband Antennas (In-Flight Connectivity)

Microstrip & Stripline Circuits (Filters, couplers, power dividers)

Satellite Communication Systems (Low out-gassing required)

Point-to-Point Digital Radio Antennas (Backhaul, microwave links)

Guidance Systems (Missile, drone, navigation)

Test & Measurement Fixtures (Up to 100 GHz)

Space-Grade RF Electronics

What is a Controlled Depth Trench?

A Controlled Depth Trench (also known as controlled depth routing, cavity routing, or pocket milling) is a precision machining process that removes material from specific layers of a PCB to a controlled and precise depth, without cutting through the entire board.

In this product, the controlled depth trench is machined into the RT/duroid 5880 section or specific FR4 layers to create:

Component cavities – for embedding components flush with the board surface
Air gaps – for improved isolation or antenna performance
Step cavities – for hybrid assembly (SMT + wire bond)
Thermal management features – for direct heat sink attachment

Key Characteristics

Parameter	Description
Process	CNC routing with depth control (Z-axis precision)
Depth Tolerance	Typically ±0.05 mm to ±0.10 mm depending on material
Minimum Trench Width	Typically ≥0.8 mm (depending on router bit diameter)
Trench Bottom Finish	Can stop on copper layer, prepreg, or within dielectric
Inspection Method	Optical or laser depth measurement

Types of Controlled Depth Trenches

Type	Description	Typical Application
Blind Trench	Stops within dielectric layer	Component cavity, air gap
Copper-Bottomed Trench	Stops on a copper layer	Thermal pad, grounding cavity
Through Trench (routed slot)	Cuts through entire board	Mechanical clearance, shielding
Step Trench	Multiple depths in one cavity	Multi-height component embedding

Applications of Controlled Depth Trenches in RF PCBs

Application	Benefit
Embedded Passives	Components recessed below surface – reduces height, improves RF performance
Air Cavities for RF MEMS	Provides free space around moving structures
Antenna Isolation Trenches	Reduces coupling between adjacent radiators
Heat Sink Access	Direct thermal path from component to heat sink
Wire Bond Pockets	Recessed area for IC wire bonding with short wire lengths
Shielding Can Seats	Precise recess for EMI shield placement
Dielectric Constant Tuning	Removing material locally changes effective Dk

Design Considerations for Controlled Depth Trenches

Consideration	Recommendation
Minimum Trench Width	≥0.8 mm (larger for thicker boards)
Corner Radius	≥0.4 mm (router bit diameter / 2)
Depth Tolerance	Specify ±0.05 mm minimum
Layer Registration	Critical for trenches stopping on copper layers
Fiberglass Fuzzing	PTFE materials (RT/5880) may require post-trench deburring
Inspection	Request depth measurement on first article

Advantages of Controlled Depth Trenches

Advantage	Description
Component Height Reduction	Embed components to reduce overall profile
Improved RF Performance	Air cavities reduce losses and parasitic effects
Thermal Management	Direct contact between component and heat sink
Shielding Integration	Precise seats for EMI shields
Design Flexibility	Enable hybrid assembly techniques

Challenges & Mitigations

Challenge	Mitigation
Depth Control Precision	Use CNC router with Z-axis feedback; specify tolerances
Burrs / Fuzzing (PTFE)	Use sharp tools; post-process with vapor honing or manual deburring
Layer Registration	Include fiducials; specify trench-to-feature tolerances
Increased Fabrication Cost	Balance complexity vs. performance benefit

We support prototype to volume production with global shipping. Contact us for:

Trench depth measurement reports

Impedance control test coupons

Phase matching verification

Volume pricing and lead times

PWB de alta velocidade,

projeto de circuito de alta frequência,

bluetooth circuit board

Produtos recomendados

4-Layer Hybrid High-Frequency PCB – RO4003C + FR4 (Immersion Gold) Copper Clad Laminates

Contacte agora

Apresentação do FPC de duas camadas de alto desempenho com máscara de cobre RA e soldagem verde

Contacte agora

PCB cerâmica de 2 camadas ultra alta DK20 com resina de polifenileno óxido (PPO) preenchida com cerâmica TP2000 (6,1 mm de espessura, cobre nu)

Contacte agora

Fabricado com laminado composto de PTFE/cerâmica modificado TF600 DK6.0 de 0,7 mm (25 mil) para PCB de micro-ondas de RF

Contacte agora

fabricação personalizada de PCB de alta frequência RT/duroid 5870 de 2 camadas – laminado de 10 mil (0,3 mm) com acabamento ENIG

Contacte agora

Material de micro-ondas fabricado Dk (12,85) PCB TMM13i de alta frequência de 2 camadas de 150 mil – 150 mil (3,9 mm) com acabamento OSP

Contacte agora

Taconic TRF-45 Dk 4.5 laminado PTFE de cerâmica de 2 camadas de PCB de alta frequência com acabamento em ouro de imersão

Contacte agora

Detalhes dos produtos

produtos

PCB recém-enviada de Bicheng

Placa do PWB de Rogers

Placa Taconic do PWB

Placa do PWB de PTFE

Circuito impresso flexível

Placa Multilayer do PWB

PWB de alta temperatura

Placa do PWB de HDI

A impedância controlou o PWB

Protótipos do PWB

Blogue

Placa do PWB de Arlon

Placa híbrida do PWB

Placa do PWB FR-4

PWB de alta frequência

PCBs da série F4B

PCB de RF

Laminados revestidos de cobre

4-Layer Hybrid High-Frequency PCB – RT/duroid 5880 + FR4 (Immersion Gold, Controlled Depth Trench)

MOQ:	1 unidade
preço:	0.99-99USD/PCS
embalagem padrão:	embalagem
Período de entrega:	2 a 10 dias úteis
método de pagamento:	T/T, Paypal
Capacidade de abastecimento:	50000PCS

Informações detalhadas

Descrição do produto

Informações detalhadas

Lugar de origem

China

Marca

Rogers

Certificação

ISO9001

Número do modelo

5880

Quantidade de ordem mínima:

1 unidade

Preço:

0.99-99USD/PCS

Detalhes da embalagem:

embalagem

Tempo de entrega:

2 a 10 dias úteis

Termos de pagamento:

T/T, Paypal

Habilidade da fonte:

50000PCS

Descrição do produto

4-Layer Hybrid High-Frequency PCB – RT/duroid 5880 + FR4 (Immersion Gold, Controlled Depth Trench)

Key Specifications

Parameter	Details
Product Type	4-Layer Hybrid High-Frequency PCB (6-Layer Copper Structure)
Base Materials	RT/duroid 5880 (Top RF section) + High Tg FR4 (Bottom section)
Finished Board Thickness	1.0 mm
Board Dimensions	90 mm × 80 mm = 1 piece
Inner Layer Copper Weight	0.5 oz (17.5 μm)
Outer Layer Copper Weight	1 oz (35 μm) finished
Total Copper Layers	6 (including internal ground/power planes)
Solder Mask	Blue (Top & Bottom)
Silkscreen	White (Top)
Surface Finish	Immersion Gold (ENIG) – 2 microinches (0.05 μm) gold thickness
Via Plating Thickness	25 μm (1 mil) minimum in each hole
Special Features	Controlled depth trench (routed cavity / channel)
Quality Standard	IPC-6012 Class 3 (High Reliability)
Electrical Test	100% prior to shipment
Artwork Format	Gerber RS-274-X

PCB Stackup (4-Layer with 6-Layer Copper Structure)

4-Layer Hybrid High-Frequency PCB – RT/duroid 5880 + FR4 (Immersion Gold, Controlled Depth Trench) 0

What is RT/duroid 5880?

Key Properties of RT/duroid 5880

Property	Typical Value	Condition	Test Method
Dielectric Constant (Dk) – Process	2.20 ±0.02	10 GHz / 23°C	IPC-TM-650 2.5.5.5
Dielectric Constant (Dk) – Design	2.2	8–40 GHz	Differential Phase Length Method
Dissipation Factor (Df)	0.0009	10 GHz / 23°C	IPC-TM-650 2.5.5.5
Dissipation Factor (Df)	0.0004	1 MHz / 23°C	IPC-TM-650 2.5.5.3
Thermal Coefficient of Dk (TCDk)	-125 ppm/°C	-50 to 150°C	IPC-TM-650 2.5.5.5
Volume Resistivity	2 × 10⁷ MΩ·cm	C96/35/90	ASTM D257
Surface Resistivity	3 × 10⁷ MΩ	C96/35/90	ASTM D257
Specific Heat	0.96 J/g/K (0.23 cal/g/°C)	–	Calculated
Tensile Modulus (X @ 23°C)	1,070 MPa (156 kpsi)	A	ASTM D638
Tensile Modulus (Y @ 23°C)	860 MPa (125 kpsi)	A	ASTM D638
Tensile Strength (X @ 23°C)	29 MPa (4.2 kpsi)	A	ASTM D638
Tensile Strength (Y @ 23°C)	27 MPa (3.9 kpsi)	A	ASTM D638
Ultimate Strain (X @ 23°C)	6.00%	A	ASTM D638
Ultimate Strain (Y @ 23°C)	4.90%	A	ASTM D638
Compressive Modulus (Z @ 23°C)	940 MPa (136 kpsi)	A	ASTM D695
Moisture Absorption	0.02%	0.062" (1.6mm), D48/50	ASTM D570
Thermal Conductivity	0.20 W/m/K	80°C	ASTM C518
CTE – X axis	31 ppm/°C	0–100°C	IPC-TM-650 2.4.41
CTE – Y axis	48 ppm/°C	0–100°C	IPC-TM-650 2.4.41
CTE – Z axis	237 ppm/°C	0–100°C	IPC-TM-650 2.4.41
Td (Decomposition Temp.)	500°C	TGA	ASTM D3850
Density	2.2 g/cm³	–	ASTM D792
Copper Peel Strength	31.2 N/mm (5.5 pli)	After solder float, 1 oz EDC	IPC-TM-650 2.4.8
Flammability	V-0	–	UL 94
Lead-Free Process Compatible	Yes	–	–

Standard Thicknesses Available for RT/duroid 5880

Thickness (inches)	Thickness (mm)	Tolerance
0.005"	0.127 mm	±0.0005"
0.010"	0.254 mm	±0.0007"
0.020"	0.508 mm	±0.0015"
0.031"	0.787 mm	±0.0020"
0.062"	1.575 mm	±0.0030"

Additional thicknesses available from 0.0035" to 0.375" in varying increments.

Key Advantages of RT/duroid 5880

Advantage	Description
Ultra-Low Loss (Df 0.0009 @ 10 GHz)	Lowest loss of any reinforced PTFE material – ideal for millimeter-wave (up to 100 GHz+)
Tight Dk Tolerance (±0.02)	Predictable impedance and phase matching – critical for phased arrays
No Glass Weave Effect	Randomly oriented microfibers eliminate Dk variation associated with woven-glass PTFE
Uniform Panel-to-Panel	Consistent electrical properties simplify high-volume production
Wide Frequency Stability	Dk constant from 500 MHz to 40 GHz+
Low Moisture Absorption (0.02%)	Stable electrical performance in humid environments
Process-Friendly	Easily cut, sheared, and machined; resistant to solvents and reagents
Low Out-Gassing	Ideal for space and satellite applications

Typical Applications of RT/duroid 5880

Millimeter-Wave Radar (Automotive, defense, weather)

Phased Array Antennas (5G/6G, satellite, defense)

Commercial Airline Broadband Antennas (In-Flight Connectivity)

Microstrip & Stripline Circuits (Filters, couplers, power dividers)

Satellite Communication Systems (Low out-gassing required)

Point-to-Point Digital Radio Antennas (Backhaul, microwave links)

Guidance Systems (Missile, drone, navigation)

Test & Measurement Fixtures (Up to 100 GHz)

Space-Grade RF Electronics

What is a Controlled Depth Trench?

In this product, the controlled depth trench is machined into the RT/duroid 5880 section or specific FR4 layers to create:

Component cavities – for embedding components flush with the board surface
Air gaps – for improved isolation or antenna performance
Step cavities – for hybrid assembly (SMT + wire bond)
Thermal management features – for direct heat sink attachment

Key Characteristics

Parameter	Description
Process	CNC routing with depth control (Z-axis precision)
Depth Tolerance	Typically ±0.05 mm to ±0.10 mm depending on material
Minimum Trench Width	Typically ≥0.8 mm (depending on router bit diameter)
Trench Bottom Finish	Can stop on copper layer, prepreg, or within dielectric
Inspection Method	Optical or laser depth measurement

Types of Controlled Depth Trenches

Type	Description	Typical Application
Blind Trench	Stops within dielectric layer	Component cavity, air gap
Copper-Bottomed Trench	Stops on a copper layer	Thermal pad, grounding cavity
Through Trench (routed slot)	Cuts through entire board	Mechanical clearance, shielding
Step Trench	Multiple depths in one cavity	Multi-height component embedding

Applications of Controlled Depth Trenches in RF PCBs

Application	Benefit
Embedded Passives	Components recessed below surface – reduces height, improves RF performance
Air Cavities for RF MEMS	Provides free space around moving structures
Antenna Isolation Trenches	Reduces coupling between adjacent radiators
Heat Sink Access	Direct thermal path from component to heat sink
Wire Bond Pockets	Recessed area for IC wire bonding with short wire lengths
Shielding Can Seats	Precise recess for EMI shield placement
Dielectric Constant Tuning	Removing material locally changes effective Dk

Design Considerations for Controlled Depth Trenches

Consideration	Recommendation
Minimum Trench Width	≥0.8 mm (larger for thicker boards)
Corner Radius	≥0.4 mm (router bit diameter / 2)
Depth Tolerance	Specify ±0.05 mm minimum
Layer Registration	Critical for trenches stopping on copper layers
Fiberglass Fuzzing	PTFE materials (RT/5880) may require post-trench deburring
Inspection	Request depth measurement on first article

Advantages of Controlled Depth Trenches

Advantage	Description
Component Height Reduction	Embed components to reduce overall profile
Improved RF Performance	Air cavities reduce losses and parasitic effects
Thermal Management	Direct contact between component and heat sink
Shielding Integration	Precise seats for EMI shields
Design Flexibility	Enable hybrid assembly techniques

Challenges & Mitigations

Challenge	Mitigation
Depth Control Precision	Use CNC router with Z-axis feedback; specify tolerances
Burrs / Fuzzing (PTFE)	Use sharp tools; post-process with vapor honing or manual deburring
Layer Registration	Include fiducials; specify trench-to-feature tolerances
Increased Fabrication Cost	Balance complexity vs. performance benefit

We support prototype to volume production with global shipping. Contact us for:

Trench depth measurement reports

Impedance control test coupons

Phase matching verification

Volume pricing and lead times

Tag: