Folhas de cobre para materiais de circuito de alta frequência
Pessoa de Contato : Sally Mao
Número de telefone : 86-755-27374847
Whatsapp : +8618277967574
Descrição de produto
When a design requires both a high dielectric constant for circuit miniaturization and the mechanical stability of a thick multilayer construction, the challenge extends beyond material selection—it becomes a question of how to combine materials with different thermal and mechanical characteristics into a reliable finished board. The RO3010 laminate from Rogers Corporation addresses the electrical side of this equation, while careful stack-up design and lamination process
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