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Casa ProdutosPlaca híbrida do PWBRogers RO4450F Bondply be used for 8-Layer copper weight Mixed-Material PCB that 4mil RO4350B + TG170 FR-4 + 8mil RO4003C
Rogers RO4450F Bondply be used for 8-Layer copper weight Mixed-Material PCB that 4mil RO4350B + TG170 FR-4 + 8mil RO4003C
Rogers RO4450F Bondply be used for 8-Layer copper weight Mixed-Material PCB that 4mil RO4350B + TG170 FR-4 + 8mil RO4003C Rogers RO4450F Bondply be used for 8-Layer copper weight Mixed-Material PCB that 4mil RO4350B + TG170 FR-4 + 8mil RO4003C
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Rogers RO4450F Bondply be used for 8-Layer copper weight Mixed-Material PCB that 4mil RO4350B + TG170 FR-4 + 8mil RO4003C

Marca: Rogers Número do modelo: RO4450F

Descrição de produto

Building a multilayer board that combines the high-frequency performance of Rogers laminates with the cost-efficiency of FR-4 requires more than just stacking materials—it requires a bonding layer that can bridge two different material systems without compromising electrical or mechanical integrity. The RO4450F bondply from Rogers Corporation is engineered for exactly this challenge. The RO4400™ bondply family is comprised of prepreg grades based on the RO4000 series core

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