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Casa ProdutosPlaca híbrida do PWB10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias
10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias
10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias 10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias 10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias
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10-layer multilayer hybrid RO4350B+Tg170 TU-768 FR4 RF/microwave PCB with Resin-Filled and Plated-Flat Vias

Marca: Rogers Número do modelo: RO4350B + Tg170 TU-768 FR4

Descrição de produto

This article presents a detailed design strategy for a 10-layer hybrid RF PCB that combines the exceptional high-frequency performance of Rogers RO4350B™ on both the top and bottom layers with the high thermal reliability and cost-effectiveness of Tg170 TU-768 FR4 in the inner layers. This hybrid construction is specifically engineered to meet the demands of complex RF/microwave modules requiring symmetric high-frequency performance, multiple SMT reflow cycles, and reliable

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