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Casa ProdutosPlaca híbrida do PWB4-Layer Hybrid RO4003C laminate + Dual Tg170 FR4 Prepreg print circuit board (PCB)
4-Layer Hybrid RO4003C laminate + Dual Tg170 FR4 Prepreg print circuit board (PCB)
4-Layer Hybrid RO4003C laminate + Dual Tg170 FR4 Prepreg print circuit board (PCB) 4-Layer Hybrid RO4003C laminate + Dual Tg170 FR4 Prepreg print circuit board (PCB) 4-Layer Hybrid RO4003C laminate + Dual Tg170 FR4 Prepreg print circuit board (PCB)
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4-Layer Hybrid RO4003C laminate + Dual Tg170 FR4 Prepreg print circuit board (PCB)

Marca: Rogers Número do modelo: RO4003C+FR4

Descrição de produto

This article presents the design rationale for a 4-layer hybrid dielectric PCB that combines the superior high-frequency performance of Rogers RO4003C™ with the cost-effectiveness and thermal reliability of Tg170 FR4 prepreg. This hybrid construction is engineered for RF/microwave applications requiring controlled impedance, low signal attenuation, and reliable thermal performance in a compact, thin form factor. By utilizing RO4003C as the RF signal layer and Tg170 FR4

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